Single wire saw
The NCS200 single wire saw can process pieces up to 200 × 200 × 200 mm.
The great length and high speed of the wire enable fast cutting: a 100 × 100 mm quartz piece can be cut in less than 2 hours.
A Y-axis displacement indexing table with tilt and rotation enables cutting along crystal planes.
Successive cuts of varying thicknesses are also possible.
The RTD6800 multi-wire saw can cut extremely hard materials such as sapphire. It can process ingots up to 200 mm diameter and up to 150 mm long.
The tangential cutting with the diamond wires results in good roughness and flatness. 150 wafers can be cut simultaneously with a typical 1 mm stepover.
Ultrasonic drilling is a promising technology for brittle materials. Machining is carried out using an abrasive solution in which the entire workpiece is immersed. The selective machining is performed by means of a sonotrode presenting the negative of the pattern to be machined and that vibrates at an ultrasonic frequency. This sonotrode selectively accelerates the abrasive grits close to its contours which are then being reproduced by abrasion in the workpiece: the perfect non-contact punch! The advantages of this technology:
- Soft machining resulting in little chipping,
- Compliance with dimensional tolerances within a few hundredths of a millimetre,
- Possibility to drill complex shapes such as square or asymmetrical ones…,
ID saw TS 23
Equipment designed for cutting hard and brittle materials into slices of high precision and fineness. This machine works on the principle of ‘ID-cutting’, i.e., cut is made by the inner diameter of a diamond ring.
The crystal is positioned on a swivel arm allowing an oriented cutting in φ and θ, from 5 mm to 100 mm, with a thickness from 400 µm to 500 µm.